Home  Products Search  Properties Search  中文版
Home > Dictionary > Information
ethylene-ethyl acrylate copolymer;EEA
Molecular formula :

nature : ethylene ethyl acrylate and the random copolymer. Ethyl Acrylate content of 5% ~ 20%, density 0.93g/cm3, Shore hardness of 86, softening point of 64 ° C, crisp temperature -95 ° C, 10.79MPa tensile strength, elongation 550%, low-temperature flexibility and good adhesion. Thermal stability than the ethylene-vinyl acetate copolymer (EVA) good. By ethylene ethyl acrylate and high temperature, high pressure free radical polymerization. The main use of a composite packaging film adhesive layer, hot melt adhesives, wire and cable coating, medical tubes, surgical kits, ring, toys.

Notice:Each item can have many explanations from different angels. If you want grasp the item comprehensively,please see below "more details data".
Please see below "More Detailed Data"
More Detailed Data:
1) ethylene-acrylate copolymer
2) Ethanol, 2-ethoxy-, acetate;1-acetoxy-2-ethoxyethane;2-eea;2-ethoxyethanol acetate;2-etossietil-acetato (italian);acetate de cellosolve (french);aethylenglykolaetheracetat (german);beta-ethoxyethyl acetate;celosolvacetat;csac;2-ethoxy-ethano acetate;ethoxyethyl acetate;ethyl cellosolve acetaat;ethyl cellosolve acetaat (dutch);ethyl glycol a
3) acrylate copolymer
4) interpolymer;copolymer
5) copolymer
6) ethinyl estradiol;EE
7) epoxy equivalent;EE;epoxide equivalent;epoxy equivalent value;weight per epoxide;WPE;epoxy equivalent per weight;EEW
8) crude fat;ether extract;EE
9) ethyl acrylate;acrylic acid ethyl ester
10) Ethyl acrylate
Notice Some description was translated by software and the data is only as a reference.
1) Thick epitaxy method capable of keeping good graphic completeness
2) Method for eliminating primary pit defects of silicon monocrystal device making area
3) Method for accurately controlling ion implantation concentration and pressure compensating factor synchronous control method
4) Two-step reduction etching technique capable of reducing grid characteristic dimension
5) Novel ultra-thin nitrogen-contained grid medium preparing method
6) Method for forming auto-alignment contact window
7) Wafer jetter assembly
8) Wafer bonding surface processing agent and wafer bonding method
9) Silicon microbridge corrosion unit for ferroelectric film infrared detector
10) Plasma etching method for eliminating organic substance using sulfur dioxide mixture gas