| Original document(16 pages) Authorized document(16 pages) 中文版 |
A double copper-clad laminate capable of increasing a production efficiency for printed wiring boards by improving the warpage problem thereof when copper foils of different thicknesses are cladded on both surfaces thereof, characterized in that a first copper foil not re-crystallized by hot pressing when the copper-clad laminate is manufactured is used on one surface side of the copper-clad laminate and a second copper foil re-crystallized by hot pressing when the copper-clad laminate is manufactured is used on the other surface side thereof, and the thickness of the second copper foil is larger than that of the first copper foil. |
Application Number
申请号 |
01802529 |
Application Date
申请日 |
2001.08.22 |
| Title 名称 |
Copper-clad laminate |
Publication Number
公开号 |
1388777 |
Publication Date
公开日 |
2003.01.01 |
| Approval Pub. Date |
2006.04.12 |
Granted Pub. Date |
2006.04.12 |
| International Classification 分类号 |
B32B15/08;H05K1/09 |
Applicant(s) Name
申请人 |
Mitsui Mining & Smelting Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Yamamoto Takuya;Nagatani Seiji;Nakano Masahiko |
| Attorney & Agent 代理人 |
chen jianhua |
| More information 更 多 信 息 |
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