Original document(33 pages) Authorized document(33 pages) 中文版
    A press-fitting unit includes a vertically movable press blade for press-fitting a stripped end of an electrical wire to a terminal disposed in a connector. A connector retaining bar movable in a horizontal direction is disposed to be opposed to the press blade. The retaining bar is provided with a plurality of connector receiving recesses in parallel to respectively hold a connector with a press-fit terminal. A wire chuck is disposed so as to opposing to the rear part of the press blade. The wire chuck is horizontally movable along a horizontal guide to a side of the press blade so as to holding the wire. Alternatively, the connector retaining bar is fixed to the apparatus by a frame and a transfer mechanism can carry the press-fitting unit along the bar in a horizontal direction. In addition, the apparatus may have a pair or two pairs of the upper and lower symmetrical press-fitting units; and the connector retaining bar is disposed between the upper and lower press-fitting units.
Application Number
申请号
02105573 Application Date
申请日
1997.05.20
Title 名称 Method and apparatus for mfg. wiring wire bundle
Publication Number
公开号
1402385 Publication Date
公开日
2003.03.12
Approval Pub. Date 2006.06.14 Granted Pub. Date 2006.06.14
International Classification 分类号 H01R43/05
Applicant(s) Name
申请人
General Yazaki Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Takata Kazuhiko
Attorney & Agent 代理人 liu zhibeng
More information 更  多  信  息


 Related patents information
Semiconductor device and mfg. method thereof
Method of making a wire harness with press-fitting contacts and apparatus therefor
Apparatus for crimping terminal to electrical wire
Method of controlling terminal crimping apparatus
Method of crimping terminal and apparatus for the same
Device for making pressure-welded electric-wire bind and process thereof
Method and apparatus of manufacturing wiring harness
Crimping apparatus and wire harness manufacturing method
Terminal mounting method and device
Electronic conductivity testing method and manufacturing device of joint distributing comobination
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.