Original document(9 pages) Authorized document(9 pages) 中文版
    A natural heat dissipation device for a microprocessor. The microprocessor is conventionally mounted to a printed circuit board. The printed circuit board contains a recess that is cut-out directly below the microprocessor. Heat sink material is attached to the microprocessor through the recess. The heat sink material attached to the bottom of the microprocessor may be used alone or in conjunction with a an attached metal tray or case under the printed circuit board.
Application Number
申请号		 97103200 Application Date
申请日		 1997.01.30
Title 名称 Surface complemental heat dissipation device
Publication Number
公开号		 1167934 Publication Date
公开日		 1997.12.17
Approval Pub. Date 2002.08.21 Granted Pub. Date 2002.08.21
International Classification 分类号 G06F1/20;H01L23/34;H05K7/20
Applicant(s) Name
申请人		 Samsung Electronics Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Ki-B Kang
Attorney & Agent 代理人 FU KANG
More information 更  多  信  息


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