The heat radiating device directly contacting with upper surface of integrated circuit includes first radiating base board whose a part is attached to the upper surface of the integrated circuit and second radiating body connected with the upper surface of the former. The first radiating base board is an interface with good heat conductance, and can quickly disperse heat source, and second radiating body is made of porous zigzagged plastic radiating sheet material. After the second radiating body is connected on the first radiating base board, they are formed into an outward radiating and an inward radiating surface to increase radiating efficiency by the action of porous ventilation and can provide good radiating effect for integrated circuit. |