| Original document(13 pages) 中文版 |
This invention is the method for protecting electric circuitry or electronic circuitry by embedding them in the compound of low molecular weight ethylene-alpha-alkene copolymer. |
Application Number
申请号 |
85107537 |
Application Date
申请日 |
1985.10.15 |
| Title 名称 |
Method for embedding electrical and electronic circuitry |
Publication Number
公开号 |
1010503 |
Publication Date
公开日 |
1987.04.15 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
H01B3/18,H01B3/30,H01B7/18,H01B7/28 |
Applicant(s) Name
申请人 |
Uniroyal Inc. (US) World headquarters, Middlebury Connecticut 06749, U.S.A. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Aspet V. Merijanian |
| Attorney & Agent 代理人 |
MU DEJUN TIANG YUE |
| More information 更 多 信 息 |
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