| Original document(24 pages) 中文版 |
The invented processing method can be used to modify in accordance with the predetermined way the original photographic plate of the precise image of the circuit diagram which is to be made on the PCB (printed circuit board) in a proportion of 1:1. By means of such method, metallic wires can be distributed uniformly on both sides of a PCB or PC sheet. The electroplating layer of both sides of the PCB or PC sheet produced in such way can be made uniform through the electrodeposit period. |
Application Number
申请号 |
85107672 |
Application Date
申请日 |
1985.10.19 |
| Title 名称 |
Equal distribution density process |
Publication Number
公开号 |
1010885 |
Publication Date
公开日 |
1987.05.06 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
H05K3/00,H05K3/46 |
Applicant(s) Name
申请人 |
Honeywell Information Systems Inc., (US) 200 Smith Street, Waltham, Massachusett |
| Address 地址 |
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| Inventor(s) Name 发明人 |
David. L. Dufour, John. P. Doherty, Michael J. Sullivan |
| Attorney & Agent 代理人 |
SHA JIE |
| More information 更 多 信 息 |
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