| Original document(37 pages) 中文版 |
Two-pack adhesive systems which are curable by free radical polymerization at room temperatures are disclosed. The adhesives bond a variety of substrates, including metals and plastics. The adhesives comprise a first part containing free radical polymerizable unsaturated monomer and free radical source and a second part comprising free radical polymerizable unsaturated monomer and an activator compound for the free radical source. The activator compound is a bicyclic amidine, with 1,8-diaza-bicyclo [5,4,0] undec-7-ene being especially preferred. The use of cupric salts enhances polymerization rate. |
Application Number
申请号 |
86106944 |
Application Date
申请日 |
1986.10.07 |
| Title 名称 |
Structural adhesive formulation |
Publication Number
公开号 |
1011484 |
Publication Date
公开日 |
1987.06.10 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
C08F291/00;C08K5/34;C08L9/00;C08L33/14;C09J3/14 |
Applicant(s) Name
申请人 |
Lord Corp. (US) 2000 West Grandview Blvd Erie, State of Pennsylvania U.S.A. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Denis Jerome Zalucha |
| Attorney & Agent 代理人 |
LI LUOYING |
| More information 更 多 信 息 |
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