Original document(23 pages)  中文版
    The invention discloses a separately feed type thermal activation structure agglomerant, which comprises at least one free radical polymerisable unsaturated monomer and a compound composed of a solidifier containing mainly an overoxidating free radical source and an activator. The activator contains bicyclic phenol amidine, inorganic acid, sulfoacid and carboxylic acid.
Application Number
申请号
86106964 Application Date
申请日
1986.10.07
Title 名称 One package structual adhesive compositions
Publication Number
公开号
1011485 Publication Date
公开日
1987.06.10
Approval Pub. Date Granted Pub. Date
International Classification 分类号 C08F291/00;C08K13/02;C08L9/00;C08L33/14;C09J3/14
Applicant(s) Name
申请人
Lord Corp. (US) 2000 West Grandview Blvd Erie. State of Pennsylvania, U.S.A.
Address 地址
Inventor(s) Name 发明人 Denis Jerome Zalucha
Attorney & Agent 代理人 LI LUOYING
More information 更  多  信  息


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