Original document(13 pages) Authorized document(12 pages) 中文版
    Title: Solder and electronic circuit using the same
Application Number
申请号		 89106247 Application Date
申请日		 1989.07.28
Title 名称 Solder and electronic circuit using the same
Publication Number
公开号		 1039987 Publication Date
公开日		 1990.02.28
Approval Pub. Date Granted Pub. Date 1993.06.16
International Classification 分类号 B23K35/26,H05K3/34
Applicant(s) Name
申请人		 Hitachi Ltd.
Address 地址
Inventor(s) Name 发明人 Masahide Harada, Muneo Oshima
Attorney & Agent 代理人 XIAO JUCHANG XU XINGEN
More information 更  多  信  息


 Related patents information
Manufacturing method of semiconductor device and electron device, calculating method of welding condition
Electronic device
Semiconductor device and electronic control unit using the same
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.