| Original document(4 pages) Authorized document(4 pages) 中文版 |
The said invention is a kind of copper-based polyphyletic alloy solder, which can successfully replace silver-copper solder in soldering lattice stem. It contains 6-7% Sn, 4-6% Zn, 0.2-0.4% P, and 0.1-0.15% rare earth element in total weight; the priority selected component is 6.5% Sn, 5% Zn, 0.3% P, and 0.12% rare earth element. |
Application Number
申请号 |
89102186 |
Application Date
申请日 |
1989.04.08 |
| Title 名称 |
Copper-based polybasic alloy soldering materials |
Publication Number
公开号 |
1039986 |
Publication Date
公开日 |
1990.02.28 |
| Approval Pub. Date |
|
Granted Pub. Date |
1991.07.31 |
| International Classification 分类号 |
B23K35/28,B23K35/30 |
Applicant(s) Name
申请人 |
Zhejiang Univ. Materials Maker |
| Address 地址 |
|
| Inventor(s) Name 发明人 |
Chen Guohua |
| Attorney & Agent 代理人 |
CUI YONGCAI |
| More information 更 多 信 息 |
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