Original document(27 pages)  中文版
    The present invention provides a multi-layer superconductive circuit substrate, which comprises isolation layers, and inner connection modules of superconductive ceramic material arranged between the isolation layers; the superconductive ceramic material modules are mutually connected through superconductive ceramic material through holes. The ceramic material modules are preferred to be packed with gold, enclosure, platinum and the alloys.
Application Number
申请号		 89109655 Application Date
申请日		 1989.12.31
Title 名称 Multi-layer superconducting circuit substrate and process for manufacturing same
Publication Number
公开号		 1044869 Publication Date
公开日		 1990.08.22
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01B12/06;H01L39/12
Applicant(s) Name
申请人		 Fujitsu Ltd.
Address 地址
Inventor(s) Name 发明人 Yoshikiko Imanaka
Attorney & Agent 代理人 ZHAO RONGMIN
More information 更  多  信  息


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