Original document(8 pages) Authorized document(4 pages) 中文版
    This invention features that triethoxy methyl silane, diethoxy dimethyl silane and triethoxy phenyl silane are used as raw materials, which undergo hydrolysis and condensation to produce an organosilicon resin. An ablative heat-insulating coating is prepared by mixing such materials (wt.%) as the said organosilicon resin (30-40), moscovite powder (30-45), Cr2O3 (10-20) and aluminium-silicate fibre (10-20), and diluting the mixture by anhydrous alcohol. The coating has following advantages: good technological performance,, no poison, and resisting high and low temp., erosion by high-speed air flow and 2000 deg.C instantaneous temp.
Application Number
申请号
89105910 Application Date
申请日
1989.05.09
Title 名称 Ablative heat-isolating coating and process for preparing its spirit organosilicon resin
Publication Number
公开号
1047314 Publication Date
公开日
1990.11.28
Approval Pub. Date Granted Pub. Date 1994.11.23
International Classification 分类号 C08L83/04,C09D183/00
Applicant(s) Name
申请人
Branch No.1 of Chenguang Chemical Inst., Ministry of Chemical Industry
Address 地址
Inventor(s) Name 发明人 Chen Xianyu, Li Wei
Attorney & Agent 代理人 YANG JUNHUA
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