To provide a resin mold type of electronic device which can prevent the break of a lead after formation of the lead or the transformation of the lead by the shock at the time of taking in and out or transportation of a testing socket, concerning a resin mold type of electronic device, especially, in a resin mold type of semiconductor device for mounting on a surface. The prevention of transformation of leads and the simplification of the process can be accomplished by charging resin 3 as far as the area between the leads 2 led out of the package body 1 by public transfer mold method, using a lead frame, which does not have dam bars between outer leads, for the assembling of a resin mold type of semiconductor device for mounting on a surface, and making the resin 3 between the leads 2 in the thickness approximately equal to the thickness of the lead 2. Moreover, the improvement of the close adhesion between the leads 2 and the resin 3 between them can be accomplished by fixing the heads of the leads together with the resin 3 with a ring-shaped resin frame. |