Original document(51 pages) Authorized document(51 pages) 中文版
    Title: A capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
Application Number
申请号		 94106952 Application Date
申请日		 1994.04.29
Title 名称 A capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
Publication Number
公开号		 1098819 Publication Date
公开日		 1995.02.15
Approval Pub. Date Granted Pub. Date 1996.05.29
International Classification 分类号 H01L21/441,H01L23/48
Applicant(s) Name
申请人		 Matsushita Electric Industrial Co. Ltd.
Address 地址
Inventor(s) Name 发明人 Yoshihiro Tomura
Attorney & Agent 代理人 XIAO JUCHANG CHENG TIANZHENG

  
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