The invention provides a sputtering apparatus using rectangular targets to form a thin film on a substrate, and includes a plurality of magnets disposed along both side edges of each target in such a manner that the polarities of adjacent magnets along the side edges of the targets are opposite, and polarities of the magnets confronting each other across the targets are opposite. The surfaces of at least two targets are inclined to a surface of the substrate at an angle not smaller than 30 DEG and not larger than 60 DEG . The sputtering device improves the uniformity of the film thickness and film quality of a thin film formed on a large substrate by a sputtering electrode provided with plural rectangular targets, and the utilizing efficiency of the targets is high. |