Original document(32 pages)  中文版
    A holder driving mechanism holds a wafer holder with gripping portions, and swings it within a wafer processing bath. When the peripheral portion of a wafer comes into contact with the distal end portion of a swing support member, the wafer rotates and vertically moves in the wafer holder. The wafer can be efficiently swung, and processing can be made uniform. By supplying ultrasonic waves from an ultrasonic bath, the processing rate can be increased.
Application Number
申请号		 02130553 Application Date
申请日		 2002.08.16
Title 名称 Method for mfg. semiconductor substrate
Publication Number
公开号		 1420524 Publication Date
公开日		 2003.05.28
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/00
Applicant(s) Name
申请人		 Canon K.K.
Address 地址
Inventor(s) Name 发明人 Yanagita Ichiryu;Sakakuchi Kiyofumi
Attorney & Agent 代理人 wang yonggang

  
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