This invention discloses a laminated chip full color LED package structure and method mainly utilizing the package technology to die bond more than two various single-colour LED by lamination by heat or supersonic wave with metal oxide transparent conductive layer and metal reflection layer to make the lower layer of monocolour light mix with another via the transparent conductive layer to generate another color light source. The lowest is die bonded with metal reflection layer to reflect different colors of light and increase its intensity. In near distance, white or full color light are displayed and a full color LED is got by laminating the three basic colors while for remote two separated LED are used eg. yellow blue or red, green. |