Original document(7 pages)  中文版
    A method for fabricating a semiconductor device including a silicon substrate includes forming a thin Oxide base film on a substrate, and then annealing the substrate in ammonia. FET gates are then conventionally formed over the gate insulator. The resultant gate insulator is electrically insulative without degrading performance with respect to a conventioanal gate oxide insulator.
Application Number
申请号
00816802 Application Date
申请日
2000.12.05
Title 名称 Method for establishing ultra-thin gate insulator using anneal in ammonia
Publication Number
公开号
1423832 Publication Date
公开日
2003.06.11
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/28
Applicant(s) Name
申请人
Advanced Micro Devices, Inc.
Address 地址
Inventor(s) Name 发明人 E.K. Ibok
Attorney & Agent 代理人 cheng wei
More information 更  多  信  息


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