Original document(14 pages)  中文版
    A heat sink for a microprocessor includes a thermally conductive base having a plurality of fin structures upwardly extending from the thermally conductive base. The plurality of fin structures having a first surface comprising a plurality of surface area enhancer structures to increase a convection surface area of the heat sink for a given volume of a heat sink to enhance heat dissipation from the heat sink.
Application Number
申请号		 01808077 Application Date
申请日		 2001.02.07
Title 名称 Parallel-plate/pin-fin hybrid copper heat sink for coding high-powered microprocessor
Publication Number
公开号		 1423838 Publication Date
公开日		 2003.06.11
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L23/367;H01L23/467
Applicant(s) Name
申请人		 Intel Corporation
Address 地址
Inventor(s) Name 发明人 A.N. Kabadi
Attorney & Agent 代理人 cui yaobeng zheng jianhui
More information 更  多  信  息


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