Original document(19 pages)  中文版
    Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.
Application Number
申请号		 02153558 Application Date
申请日		 2002.11.26
Title 名称 Dielectric structure
Publication Number
公开号		 1424732 Publication Date
公开日		 2003.06.18
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01G4/018;H05K1/16;H05K3/46
Applicant(s) Name
申请人		 Hipley Corp.
Address 地址
Inventor(s) Name 发明人 C.S. Allan;M.A. Gezanick;D.L. Jakan
Attorney & Agent 代理人 bao ling wang gang

  
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