Original document(12 pages)  中文版
    An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.
Application Number
申请号		 00818649 Application Date
申请日		 2000.12.20
Title 名称 Interconnection device and method
Publication Number
公开号		 1425199 Publication Date
公开日		 2003.06.18
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L23/66
Applicant(s) Name
申请人		 HEI Inc.
Address 地址
Inventor(s) Name 发明人 Huang Guanghua;P. Chandler
Attorney & Agent 代理人 fu jianjun

  
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