| Original document(9 pages) Authorized document(9 pages) 中文版 |
The present invention relates to integrated circuit manufacture technology, and is especially wet process of cleaning metal copepr in the back. When metal copper is deposited as connection material to the right side of wafer, one thin layer of copper is also formed in the back side and should be eliminated before the wafer is treated in the subsequent steps. The present invention proposes one cleaning technological process adopting aqueous acid pickling solution plus oxidant mixed solution with excellent cleaning effect. |
Application Number
申请号 |
03114702 |
Application Date
申请日 |
2003.01.02 |
| Title 名称 |
Method for wet cleaning metal copper back |
Publication Number
公开号 |
1425802 |
Publication Date
公开日 |
2003.06.25 |
| Approval Pub. Date |
|
Granted Pub. Date |
2005.11.23 |
| International Classification 分类号 |
C23F1/18,C23G1/10 |
Applicant(s) Name
申请人 |
Huahong (Group) Co., Ltd., Shanghai |
| Address 地址 |
200020 |
| Inventor(s) Name 发明人 |
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| Attorney & Agent 代理人 |
lu fei tao jinlong |
| More information 更 多 信 息 |
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