| Original document(4 pages) 中文版 |
The composite soil wood floor board includes facing single wood sheet layer and base material layer with bridging layer of resin soaked paper in between. The surface layer compounding process includes laying resin soaked paper between facing single wood sheet layer and the base material layer, assembling, hot pressing and post-processint to form integrated floor board. The present invention has high work efficiency and low cost. |
Application Number
申请号 |
03101255 |
Application Date
申请日 |
2003.01.13 |
| Title 名称 |
Solid wood composite floor and surface layer compounding process |
Publication Number
公开号 |
1425837 |
Publication Date
公开日 |
2003.06.25 |
| Approval Pub. Date |
|
Granted Pub. Date |
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| International Classification 分类号 |
B32B21/06,E04F15/02 |
Applicant(s) Name
申请人 |
Senjia Carpentery Manufacturing Factory, Hangzhou |
| Address 地址 |
310004 |
| Inventor(s) Name 发明人 |
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| Attorney & Agent 代理人 |
weng jimeng |
| More information 更 多 信 息 |
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