| Original document(45 pages) 中文版 |
Provided is an electronic device, and its manufacturing method, in which a cap body for sustaining vacuum is provided for each cell utilizing an existing fabrication process of electronic device. An Al film (151) is formed on a wafer (150) for cap and then patterned to form an annular film (144). A tubular part (142) surrounding a recess becoming a vacuum dome is formed by performing etching using the annular film (144) as a mask. Subsequently, a cut (152) is made in the substrate part (141) of the wafer (150) for cap and the wafer (150) for cap is mounted on a main wafer (100) on which an infrared area sensor is formed. Finally, the annular film (144) of the wafer (150) for cap is bonded to the annular film (118) of the main wafer (100) by compression thus forming an annular bonded part (15). |
Application Number
申请号 |
02123054 |
Application Date
申请日 |
2002.06.11 |
| Title 名称 |
Electronic device and manufacture thereof |
Publication Number
公开号 |
1391280 |
Publication Date
公开日 |
2003.01.15 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
B29C67/00;H01L21/50;H01L27/00;H05K13/00 |
Applicant(s) Name
申请人 |
Matsushita Electric Ind. Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Komobuchi Hiroudo;Hisashi Yasusane;Hashimoto Masahiko |
| Attorney & Agent 代理人 |
wang huimin |
| More information 更 多 信 息 |
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