| Original document(43 pages) 中文版 |
A highly reliable semiconductor device capable of miniaturization and reduction in manufacturing cost with a board having a recessed portion for mounting a semiconductor element. A wiring material capable of draw machining which is constituted of a copper wiring (12) to be a wiring member, a barrier layer (11) comprising a nickel alloy or the like, and a copper foil (10) to be a carrier layer is adhered to a resin board (14, 15) and at the same time pressed by a protrusion (13a) of a mold (13) to form a wiring (2) buried in the surface of the board. Also, by providing a step between an inner connection terminal portion to be connected to a semiconductor element (1) and an outer connection terminal portion to be connected to an outer connection terminal (5), which constitute both ends of the wiring (2), a recessed portion which can house the semiconductor element (1) is formed at a center part of the board. |
Application Number
申请号 |
98804590 |
Application Date
申请日 |
1998.04.30 |
| Title 名称 |
Board for mounting semiconductor element, method for manufacturing same, and semiconductor device
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Publication Number
公开号 |
1253662 |
Publication Date
公开日 |
2000.05.17 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
H01L23/12 |
Applicant(s) Name
申请人 |
Hitachi Chemical Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Fukutomi Naoki;Wakashima Yoshiaki;Naoyuki Susumu |
| Attorney & Agent 代理人 |
wang yonggang |
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