A socket for receiving a semiconductor component (10) having an electric terminal (12) comprises a contact (31), to which the electric terminal is connected, and a driving mechanism for moving the contact toward the electric terminal when the semiconductor component is inserted into an insertion position in the socket. The driving mechanism has a movable separation member (40) for keeping the contact (31) away from the insertion position of the semiconductor component (10) when the semiconductor component is not inserted in the socket. The socket also has a spring (50) which is compressed as the semiconductor component is inserted, and pushes back the movable separation member (40) toward the semiconductor component. |