The present invention relates to a resin composition, an adhesive for connecting a circuit member using the resin composition and a circuit board comprising (A) a polyhydroxy polyether resin represented by the formula (I): wherein R<1> to R<8> each represent H, C1-4 alkyl group, C2-5 alkenyl group, C1-4 hydroxyalkyl group or halogen atom; Ra represents H or C1-2 alkyl group; Rb represents C2-13 alkyl group; and n is a recurring number, or the following formula (II): wherein R<9> to R<12> each represent H, C1-6 alkyl group, C1-6 hydroxyalkyl group or halogen atom; Rc to Rf each represent H, C1-6 alkyl group, cyclohexyl group, aryl group, aralkyl group or halogen atom; and m is a recurring number, and (B) a three dimensionally cross-linkable resin. |