| Original document(17 pages) 中文版 |
A test device for integrated circuit chip installed on the circuit board includes: one upper assembly; one lower assembly; and several guide pins extending from the upper surface of the lower assembly. The circuit board is aligned along the guide pins and installed on the lower assembly and the upper assembly is aligned along the guide pins so that the circuit board is installed between the two assembleis. A rotable shaft is set and penetrated through the upper assembly to connect the two assemblies together. A rotable knob located in the upper assembly makes the lower assembly move towards the circuit board by its rotation so as to connect the IC chip and test pins in the lower assembly. The test device may be easily installed in the circuit board to result in accurate test result. |
Application Number
申请号 |
01124709 |
Application Date
申请日 |
2001.07.26 |
| Title 名称 |
BGA tester on circuit board |
Publication Number
公开号 |
1399140 |
Publication Date
公开日 |
2003.02.26 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
G01R31/26,G01R31/28,H01L21/66 |
Applicant(s) Name
申请人 |
Delaware Capital Formation Inc. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
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| Attorney & Agent 代理人 |
wang jinglin |
| More information 更 多 信 息 |
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