Original document(26 pages)  中文版
    A punching die for carrier film is chemico-mechanical grinder is composed of a base, a first plate movable between the first and the second positions, and a second plate with multiple punching heads movable between the third and the fourth positions. When the second plate is at the third position, the first plate is at the first position. When the second plate is at the fourth position, the first plate is at the second position for contacting with the said carrier film and punching on it. A maintenance method for punching die is also disclosed for raising efficiency.
Application Number
申请号		 01144465 Application Date
申请日		 2001.12.18
Title 名称 Punching mould of carrier film of chemical mechanical grinder and mulntenance method used for said mould
Publication Number
公开号		 1426860 Publication Date
公开日		 2003.07.02
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B21D22/06
Applicant(s) Name
申请人		 Nanya Science and Technology Co. Ltd.
Address 地址
Inventor(s) Name 发明人 Wu Wanyi
Attorney & Agent 代理人 ma yajia
More information 更  多  信  息


 Related patents information
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.