Original document(6 pages) Authorized document(6 pages) 中文版
    The present invention relates to a device for punching plastic materials especially enabling to produce plug-in cut-outs for chip boards. The punch (10) cooperates with a die and the plastic material to be punched (1) is located between said punch and said die. In order to avoid drawbacks related to the cutting edge quality, according to the invention, the die cutting surface is designed in order to have a punching angle less than 90 DEG.
Application Number
申请号
01809374 Application Date
申请日
2001.05.14
Title 名称 Device for punching plastic materials
Publication Number
公开号
1429378 Publication Date
公开日
2003.07.09
Approval Pub. Date 2006.05.03 Granted Pub. Date 2006.05.03
International Classification 分类号 G06K19/077
Applicant(s) Name
申请人
Giesecke & Devrient GmbH
Address 地址
Inventor(s) Name 发明人 G. Drescher
Attorney & Agent 代理人 li xiaoshu wei xiaogang
More information 更  多  信  息


 Related patents information
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.