Original document(43 pages) Authorized document(42 pages) 中文版
    A sapphire substrate (1) is etched in a stripe pattern having a width of 10 mum, an interval of 10 mum, and a depth of 10 mum. An AlN buffer layer (2) with a thickness of about 40 nm is formed mainly on the top and bottom surfaces of a step on the substrate (1). A GaN layer (3) is formed by vertical and horizontal epitaxial growth. Thus the step is covered by the buffer layer (21) grown on the top surface of the step by horizontal epitaxy, and therefore the surface is planarized. The threading dislocations in the portion of the GaN layer (3) above the bottom of the step are significantly suppressed compared with the portion thereof above the top of the step.
Application Number
申请号
01809479 Application Date
申请日
2001.02.23
Title 名称 Group III nitride compound semiconductor and method for manufacturing the same
Publication Number
公开号
1429402 Publication Date
公开日
2003.07.09
Approval Pub. Date 2006.09.06 Granted Pub. Date 2006.09.06
International Classification 分类号 H01L21/205;C30B29/38;H01L33/00;H01S5/323
Applicant(s) Name
申请人
Toyoda Gosei Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Tezen Yuta
Attorney & Agent 代理人 li xiaoshu wei xiaogang
More information 更  多  信  息


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