Original document(18 pages) Authorized document(16 pages) 中文版
    An encapsulated microelectronic device. The device includes a semiconductor substrate, microelectronic device adjacent to the semiconductor substrate, and at least one first barrier stack adjacent to the microelectronic device. The barrier stack encapsulates the microelectronic device. It includes at least one first barrier layer and at least one first polymer layer. The encapsulated microelectronic device optionally includes at least one second barrier stack located between the semiconductor substrate and the microelectronic device. The second barrier stack includes at least one second barrier layer and at least one second polymer layer. A method for making an encapsulated microelectronic device is also disclosed.
Application Number
申请号		 01809531 Application Date
申请日		 2001.03.01
Title 名称 Encapsulated microelectronic devices
Publication Number
公开号		 1429412 Publication Date
公开日		 2003.07.09
Approval Pub. Date 2006.08.16 Granted Pub. Date 2006.08.16
International Classification 分类号 H01L23/28
Applicant(s) Name
申请人		 Battelle Memorial Inst.
Address 地址
Inventor(s) Name 发明人 G.L. Graff;P.M. Martin;M.E. Gross
Attorney & Agent 代理人 xiao chunjing zhang shegao
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