Original document(15 pages) Authorized document(17 pages) 中文版
    A room temperature curable organopolysiloxane composition of the ketone removal type comprising a diorganopolysiloxane having a minimized content of low-molecular-weight organopolysiloxanes as a base polymer, and an alkenoxysilane as a crosslinking agent does emit essentially no low-molecular-weight siloxanes and organic matter with the passage of time after curing and is suitable for use as a sealant in a clean room and as a sealant or adhesive on electrical and electronic parts.
Application Number
申请号		 02128199 Application Date
申请日		 2002.10.11
Title 名称 Organic polyorganosiloxane composition solidified at room temp.
Publication Number
公开号		 1429862 Publication Date
公开日		 2003.07.16
Approval Pub. Date 2005.12.14 Granted Pub. Date 2005.12.14
International Classification 分类号 C08L83/14;C09K3/10
Applicant(s) Name
申请人		 Daisei Building Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Sakamoto Takafumi;Kimura Tsuneo;Wakayama Keihide
Attorney & Agent 代理人 wang jie
More information 更  多  信  息


 Related patents information
Antifouling condensation curing organopolysiloxane composition and underwater structure
Room temperature curable organopolysiloxane composition
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.