A solution for ruthenium chemical mechanical planarization containing a nitric acid and an oxidizer is disclosed. A method of forming ruthenium pattern using a polished ruthenium layer is also disclosed. The disclosed solution improves the polishing speed of ruthenium under low polishing pressure, reduces the dishing of ruthenium and decreases scratches generated in the interlayer insulating film. As a result, the disclosed solution and methods improve the techniques for device isolation and reduction of step coverage. |