Original document(9 pages) Authorized document(8 pages) 中文版
    The localized electroplating of an injection moulded component (10) comprises: delimiting at least two portions (30, 31) of the component by electrical insulation between these portions; and successive electroplating of each portion by successively disposing at least one electrode (40) at the surface of each portion. The localized electroplating of an injection moulded component (10) comprises: delimiting at least two portions (30, 31) of the component by electrical insulation between these portions; and successive electroplating of each portion by successively disposing at least one electrode at the surface of each portion, and then a non-electroplateable material being injected to make up the delimitation.
Application Number
申请号		 02160413 Application Date
申请日		 2002.12.30
Title 名称 Method for electroplating of selected surface of component
Publication Number
公开号		 1429933 Publication Date
公开日		 2003.07.16
Approval Pub. Date 2007.06.27 Granted Pub. Date 2007.06.27
International Classification 分类号 C25D5/02
Applicant(s) Name
申请人		 Alcatel
Address 地址
Inventor(s) Name 发明人 Mack Pou
Attorney & Agent 代理人 guo saiyu
More information 更  多  信  息


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