| Original document(24 pages) Authorized document(22 pages) 中文版 |
The invention provides a optical device and its manufacturing method, optical module, circuit board and electronic equipment. A second substrate including a transparent substrate is bonded to a first substrate including a plurality of optical elements each of which has an optical section, with a light transmissive adhesive layer interposed, to seal the optical sections. The first substrate is then cut into the individual optical elements. |
Application Number
申请号 |
02158353 |
Application Date
申请日 |
2002.12.27 |
| Title 名称 |
Optical device and its manufacturing method, optical module, circuit board and electronic instrument |
Publication Number
公开号 |
1430405 |
Publication Date
公开日 |
2003.07.16 |
| Approval Pub. Date |
2005.03.16 |
Granted Pub. Date |
2005.03.16 |
| International Classification 分类号 |
H01L21/52 |
Applicant(s) Name
申请人 |
Seiko Epson Corp. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Hashimoto Shinko |
| Attorney & Agent 代理人 |
wang huimin |
| More information 更 多 信 息 |
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