Original document(45 pages) Authorized document(43 pages) 中文版
    An electronic device comprising: a semiconductor chip having plural electrode pads on one main surface thereof; a wiring board having plural connection parts; and plural salient electrodes disposed respectively between the electrode pads of the semiconductor chip and the connection parts of the wiring board to provide electrical connections between the two, the salient electrodes being arranged in an array not providing balance of the semiconductor chip with respect to one main surface of the wiring board, the plural connection parts of the wiring board being arranged at a deeper position than one main surface of the wiring board in a depth direction from the one main surface.
Application Number
申请号		 01125370 Application Date
申请日		 2001.08.31
Title 名称 Electronic device and method for manufacturing this device
Publication Number
公开号		 1340857 Publication Date
公开日		 2002.03.20
Approval Pub. Date 2006.01.04 Granted Pub. Date 2006.01.04
International Classification 分类号 H01L23/48;H01L23/538;H01L21/60
Applicant(s) Name
申请人		 Hitachi Ltd.
Address 地址
Inventor(s) Name 发明人 Imasu Seishi;Kichita Ikuo;Kishikawa Norio
Attorney & Agent 代理人 wang sibeng

  
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