| Original document(11 pages) Authorized document(10 pages) 中文版 |
The making process of sealed cavity for micro electromechanical chip features that the process includes setting support body with smelting point lower than or equal to the adhering temperature between the sealing medium and the upper and lower substrates on the lower substrate with sealing medium painted, with the support body being slightly higher than the sealing medium; aligning the upper substrate onto the lower substrate; heating in vacuum oven to smelt the support body and to make the upper substrate fall down to contact with the sealing medium on the lower substrate; and subsequent processing for adhering the upper and the lower substrate to form sealed cavity. The upper and the lower substrate may be covering plate or chip and the chip may be on or below the covering plate. During the process, common vacuum oven may be used. |
Application Number
申请号 |
03141997 |
Application Date
申请日 |
2003.08.01 |
| Title 名称 |
Making process of sealed cavity for micro electromechanical chip |
Publication Number
公开号 |
1486922 |
Publication Date
公开日 |
2004.04.07 |
| Approval Pub. Date |
|
Granted Pub. Date |
2006.02.15 |
| International Classification 分类号 |
B81C5/00,H01L23/02 |
Applicant(s) Name
申请人 |
Shanghai Inst. of Microsystem &. Information Techn, CAS |
| Address 地址 |
200050 |
| Inventor(s) Name 发明人 |
Schokeredy |
| Attorney & Agent 代理人 |
pan zhen |
| More information 更 多 信 息 |
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