| Original document(45 pages) Authorized document(43 pages) 中文版 |
It is intended to provide multi-piece circuit boards capable of preventing lowering of strength of joint sections between piece sections after cutoff and other sections, and determining material of flame sections regardless of material of a piece section, and board manufacturing method of such multi-piece circuit boards. For a mixed board including a defective piece section and a good piece section in a state in which an outermost layer is not formed yet, cut lines are made around bridges and are joined together by adhesive, and an upper layer is provided thereon, whereby a multi-piece circuit board mounted on good piece sections only is formed. A frame section may be formed by arranging respective piece sections manufactured in advance at positions at which the piece sections are to be present and injecting fluid matter to surround the respective piece sections arranged to form the frame section. Furthermore, joints between respective piece sections and frame section may be provided on the frame section to surround roots of respective bridges. Furthermore, an adhesive sheet may cover each joint. |
Application Number
申请号 |
01810128 |
Application Date
申请日 |
2001.05.31 |
| Title 名称 |
Multi-piece substrate and method of manufacturing the same |
Publication Number
公开号 |
1430866 |
Publication Date
公开日 |
2003.07.16 |
| Approval Pub. Date |
2007.07.11 |
Granted Pub. Date |
2007.07.11 |
| International Classification 分类号 |
H05K3/00;H05K1/02 |
Applicant(s) Name
申请人 |
IBIDEN Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Yanase Makoto;Sagisaka Katsumi;Shimada Isao |
| Attorney & Agent 代理人 |
zhao guohua |
| More information 更 多 信 息 |
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