In one embodiment of a liquid processing apparatus, a cleaning unit (CLN) 12 includes a rotary plate 61, supporting members 64a, holding members 64b, a chemical nozzle 51 for supplying a wafer W with a chemical liquid, a spring 120 and a pressing mechanism 121 both of which moves each of the holding members 64b. The pressing mechanism 121 moves the corresponding holding member 64b so that the wafer W is held by the holding members 64b while the wafer W is apart from the supporting members 64a and conversely, the wafer W is supported by the supporting members 64a while the wafer W is apart from the holding members 64b. The spring 120 holds the corresponding holding member 64b so that the wafer W is held by the holding members 64b while the wafer W is apart from the supporting members 64a. By supplying the wafer W held by the holding members 64b with the cleaning liquid, it is possible to prevent an occurrence of unprocessed portions on the cleaned wafer W, accomplishing a uniform cleaning for the wafer W. |