| Original document(21 pages) Authorized document(21 pages) 中文版 |
A molded disc substrate obtained by injection molding is rotated at high speed before the molded disc substrate has solidified, and a gas is also made to flow in an outward radial direction along a bottom surface of the molded disc substrate while the molded disc substrate is rotating, and the rotation is stopped after the molded disc substrate has solidified. Thus, a disc substrate with little warping is obtained in a short time. |
Application Number
申请号 |
02151838 |
Application Date
申请日 |
2002.12.03 |
| Title 名称 |
Method and apparatus for treating a disc substrate |
Publication Number
公开号 |
1433880 |
Publication Date
公开日 |
2003.08.06 |
| Approval Pub. Date |
2006.01.25 |
Granted Pub. Date |
2006.01.25 |
| International Classification 分类号 |
B29C45/00;B29L17/00 |
Applicant(s) Name
申请人 |
Origin Electric Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Suzuki Takayuki;Nakamura Masahiro;Kobayashi Hideo |
| Attorney & Agent 代理人 |
xiao li chen xiaowen |
| More information 更 多 信 息 |
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