| Original document(12 pages) Authorized document(12 pages) 中文版 |
The method for packaging electronic chip element made of wafer includes the following steps: 1. making electronic chip elements on the wafer and making them spaced and arranged; 2. in the above-mentioned wafer etching the portion where the electronic chip elements are not formed to obtain slot; 3. utilizing vacuum film-pressing equipment to cover the wafer with etched slot with photo resist film or soaking the whole wafer in the container tank with photoresist, so that the whole wafer is covered with a layer of photoresist; 4. heating wafer and drying the photo resist film or photoresist to make it tightly combined on the wafer; and 5. finally, separating out the electronic chip elements from the wafer so as to obtain the packaged electric chip element unit. |
Application Number
申请号 |
02102588 |
Application Date
申请日 |
2002.01.25 |
| Title 名称 |
Package method electronic ship made from wafen |
Publication Number
公开号 |
1433931 |
Publication Date
公开日 |
2003.08.06 |
| Approval Pub. Date |
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Granted Pub. Date |
2004.12.08 |
| International Classification 分类号 |
B65B11/00,B65D85/86 |
Applicant(s) Name
申请人 |
Qiankun Science and Technology Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Zhuang Hongyi, Zeng Guoshu |
| Attorney & Agent 代理人 |
zhu liguang zhang tiebang |
| More information 更 多 信 息 |
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