Original document(30 pages) Authorized document(30 pages) 中文版
    The present invention is aimed to prevent generation of a cut remnant of a band portion extending from a head portion of a binding band and a gap of the cutting position during the binding operation of items to be bound and to form a cut end of the band portion extending from the head portion into a curved shape. The solution of the present invention is a bind apparatus 2 having a tightening function to tighten an item M to be bound around which a binding band 1 is wound and a cutting and removing function to cut and remove a surplus portion of the band portion 12 after tightening the item M. The tightening function of the binding apparatus 2 is exhibited by drawing the band portion 12 in the drawing direction in the state that a receiving surface 32 of a die 2 receives the head portion 13 of the binding band 1. The receiving surface 32 of the die 2 is formed in a valley shape to equip the receiving surface 32 with slidability. A blade tip 52 of a cutter 5 is curved.
Application Number
申请号		 02148056 Application Date
申请日		 2002.10.23
Title 名称 Binding device
Publication Number
公开号		 1433932 Publication Date
公开日		 2003.08.06
Approval Pub. Date 2006.05.10 Granted Pub. Date 2006.05.10
International Classification 分类号 B65B13/18
Applicant(s) Name
申请人		 Tyton Company of Japan Ltd.
Address 地址
Inventor(s) Name 发明人 Miyazaki Tadahiro;Ogawa Kiyoshi
Attorney & Agent 代理人 chen jian
More information 更  多  信  息


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