Original document(13 pages) Authorized document(12 pages) 中文版
    Briefly, in accordance with one embodiment of the invention, a system includes two boards coupled by a bus. The bus having a dual-terminated transmission line that communicatively couples a memory control hub with a memory repeater hub that each have a Rambus ASIC Cell (RAC). Briefly, in accordance with another embodiment of the invention, a connector has two metal traces that are of different lengths. The parasitic capacitance of the longer metal trace is increased so that the impedance of the two metal traces is substantially equal.
Application Number
申请号
00818996 Application Date
申请日
2000.11.20
Title 名称 Apparatus and method for coupling to memory module
Publication Number
公开号
1434944 Publication Date
公开日
2003.08.06
Approval Pub. Date 2007.05.30 Granted Pub. Date 2007.05.30
International Classification 分类号 G06F13/40
Applicant(s) Name
申请人
Intel Corp.
Address 地址
Inventor(s) Name 发明人 D.W. Frame;C.J. Banyai;K.H. Mauritz
Attorney & Agent 代理人 wu limeng chen ji
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