| Original document(12 pages) Authorized document(12 pages) 中文版 |
A connectino pad suitable for the semiconductor substrate with surficial dielectric layer is composed of a metallic top pad above the dielectric layer and several metallic supporters inlaid in said dielectric layer and formed on the bottom of said top pad. Its preparing process is also disclosed. Its advantages are high adhesion and low parasitic capacitance. |
Application Number
申请号 |
02103267 |
Application Date
申请日 |
2002.02.01 |
| Title 名称 |
Connecting pad structure and mfg. method thereof |
Publication Number
公开号 |
1435881 |
Publication Date
公开日 |
2003.08.13 |
| Approval Pub. Date |
|
Granted Pub. Date |
2005.11.02 |
| International Classification 分类号 |
H01L23/48,H01L21/60 |
Applicant(s) Name
申请人 |
Taiwan Integrated Circuit Mfg. Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Ma Siping, Wang Shiqi |
| Attorney & Agent 代理人 |
dai yuanyi |
| More information 更 多 信 息 |
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