A non-volatile semiconductor memory device according to the present invention includes: a plurality of element isolation regions formed at predetermined intervals in the main surface of a semiconductor substrate; a first silicon oxide film, a nitride film and a second silicon oxide film formed on the semiconductor substrate; a word line formed on the second silicon oxide film; an interlayer insulating film formed on the word line; a plurality of bit lines formed on the interlayer insulating film in a plurality of regions positioned above the plurality of element isolation regions; and an interlayer insulating film formed between the bit lines. Accordingly, in this non-volatile semiconductor memory device, the withstand voltage between the bit lines increases and, therefore, the occurrence of current leakage can be prevented so that an improvement in performance can be implemented. In addition, the manufacturing cost can be lowered. |