Original document(44 pages) Authorized document(47 pages) 中文版
    The invention provides a semiconductor memory device which is excellent in soft error resistance by adding a charge capacity to a cell node without increasing a cell area. In a semiconductor memory device with a full CMOS type memory cell, which has two n-type bulk access transistors and two n-type bulk driver transistors and two p-type bulk load transistors, respectively, a charge capacity body for charge capacity addition connected to a storage node is constituted of an insulation film and a conductive film, and the insulation film and the conductive film are formed directly on an upper side of the first and second cell nodes.
Application Number
申请号
03104204 Application Date
申请日
2003.01.29
Title 名称 Semiconductor memory device
Publication Number
公开号
1435888 Publication Date
公开日
2003.08.13
Approval Pub. Date 2006.07.05 Granted Pub. Date 2006.07.05
International Classification 分类号 H01L27/11;H01L21/824
Applicant(s) Name
申请人
Mitsubishi Electric Corp.
Address 地址
Inventor(s) Name 发明人 Obayashi Shigeki;Ishigaki Yoshiyuki;Yokoyama Takehiro
Attorney & Agent 代理人 ma tieliang ye kaidong
More information 更  多  信  息


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