Original document(66 pages) Authorized document(67 pages) 中文版
    The invention provides a semiconductor device composed of a semiconductor element or a group of semiconductor elements, in which a crystalline semiconductor film having as few grain boundaries as possible in a channel formation region is formed on an insulating surface, which can operate at high speed, which have high current drive performance, and which are less fluctuated between elements. The method of the present invention includes: forming an insulating film with an opening on a substrate having an insulating surface; forming on the insulating film and over the opening an amorphous semiconductor film or a polycrystalline semiconductor film that has randomly-formed grain boundaries; forming a crystalline semiconductor film by melting the semiconductor film, pouring the melted semiconductor into the opening of the insulating film, and crystallizing or re-crystallizing the semiconductor film; and removing the crystalline semiconductor film except a portion of the crystalline semiconductor film that is in the opening to form a gate insulating film, which is in contact with the top face of the crystalline semiconductor film, and a gate electrode.
Application Number
申请号
03102284 Application Date
申请日
2003.01.28
Title 名称 Semiconductor device and method for mfg. same
Publication Number
公开号
1435897 Publication Date
公开日
2003.08.13
Approval Pub. Date 2007.10.10 Granted Pub. Date 2007.10.10
International Classification 分类号 H01L29/786;H01L21/00;G02F1/136
Applicant(s) Name
申请人
Semiconductor Energy Laboratory Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Isobe Astsuo;Yamazaki Shunpei;Kokubo Chimin
Attorney & Agent 代理人 wang yue liang yong
More information 更  多  信  息


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