| Original document(45 pages) Authorized document(40 pages) 中文版 |
A semiconductor laser device that is suitable for mass production, that permits an improved wire layout, and that permits miniaturization includes leads disposed through each of two side faces of an insulating frame member so as to run from outside to inside the insulating frame member, an LD and a light-receiving element mounted inside the insulating frame member, and wires laid inside the insulating frame member so as to connect the leads to the electrodes of the LD and the light-receiving element. Inside the insulating frame member, the tip of one lead is extended farther inward than the edge of an element mount portion that faces the tip of another lead that is disposed through the same side face of the insulating frame member. |
Application Number
申请号 |
03103427 |
Application Date
申请日 |
2003.01.30 |
| Title 名称 |
Semiconductor laser device, mfg. method thereof and optical pick-up using said device |
Publication Number
公开号 |
1435927 |
Publication Date
公开日 |
2003.08.13 |
| Approval Pub. Date |
2006.02.22 |
Granted Pub. Date |
2006.02.22 |
| International Classification 分类号 |
H01S5/022;G11B7/125;H01L23/02 |
Applicant(s) Name
申请人 |
Sharp K.K. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Yagi Yuyusane;Matsuhara Kazunori |
| Attorney & Agent 代理人 |
tao fengbei hou yu |
| More information 更 多 信 息 |
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